Manufacturing capabilities:
Highlights:
- 15 000 m2 / year capacity
- From proto type to the small and medium range quantity
- 24 hrs turnover in case of Jet order
- 1 to 22 layers
- PWB thickness 0.1 - 5.5 mm (0.25mm ->)
- Side plating
- Contact gold, galvanic gold
- HAL, Immersion gold and immersion tin finishing
- Hole filling process (via plugging)
- PWB with aluminum substrate (heat sink)
- "Z" routing
Base material:
- FR-4, CEM-1, Polyimid high TG and HF
- Thickness of copper foil on the base material: 18u, 35u, 70u (300u can be achieved with galvanic)
- Thickness of copper foil on the inner layer: 18u, 35u, 70u
- Maximum board size:
- single- or double sided: 530x480mm
- multilayer: 450x480mm
Pattern details:
- Min. solder pad ring thickness/hole diameter: 0,5/0,2mm
- Minimum track width: 0,1mm
- Minimum insulating distance: 0,1mm
- Minimum testable SMD distance: 0,1mm
- Minimum testable SMD pad width: 0,1mm
Metal Surface:
- Thickness of plated copper in the hole: min. 25um
- Thickness of chemical tin: 1,15um (max.)
- Thickness of HASL layer: 8-30um
- Gold plating of edge connectors:
Nnickel: typical 5umgold: typical: 1-2 um (customer specified)- Electroless nickel-gold on the entire pattern or on a masked surface:
nickel: 5 umgold: 0,06 -0.08 um
Solder mask:
- Solder resist is applied by: coating with green, photosensitive: 18-30u
- Screen printing photosensitive, blue, black, white, red: 10-30u
- Notation inks: white, lemon-yellow, black (with screen printing)
- Ink-Jet printer: only white
- Conductive carbon paste: min. line thickness and line distance 0,5mm (with screen printing)
- Peelable protective mask:
blue 0,2-0,3mm (screen printing)white (tape)
Contour:
- The contour can be formed by routing into pieces or in panel with break-bridges (tabs); and also by V-cut (scoring).
Pictures
