Printed Circuit Boards

The base point of the assembly technology is the printed circuit board and for that product one of the biggest manufacturer in Hungary is Hitelap Co.

Hitelap is on the market over 22 years. Since the establishment the company has gone through important changes and built a new infrastructure. Its whole machine park has transformed regarding to the adaptation of the present modern technologies.
One of the elemental point of Hitelap's philosophies is to follow the technical development. The last couple of years brought some important change is the semiconductor industry what increased requirements for the printed circuit board manufacturers, as during the semiconductor-development new casing forms and outlet systems appeared on the market the sizes decreased but the number of the tool outlets has grown. Next to all that the intensive conduction of the heat amount got more tone than before.

Hitelap focusing the development activity to three big areas:

• The economical solution of selective side-plating technology
• Plugging and over plating of the vias under the pads (plug-in)
• New base material development for assembly of a heavy-duty tools

The selective side-plating practically mean that next to the as yet two-dimension technology comes the third-dimension. The use of the side-plating (Z-way) is very loved by the customers for more reasons. There are such micro cases, which one leading out soldering actually happens in half cut plated circles. Have to solve the transition between the plastic-metal surfaces what can not contain any material leftover or burr.

AThe via invisibility is the consequence of the unlimited size decrease. The decrease of the BGA casing raster distance made impossible the via realization between the pads that practically means that we have to put the vias under the pads to save important surfaces. The mission is to integrate the vias and pads with a safe solderable surface and good electrical connection. The via-pad combinations what has been produced this way mainly produced by chemical nickel and chemical gold surfaces.

Evergreen problem in electronics is how to conduct the heavy heat volume what is produced by the electronic tools. Mainly the power increasing of LED's with high light intensity, but also other semiconductor tools cause big challenge for the printed board manufacturers. Earlier in connection to that problem there were couples of not very lucky solution. As a solution lately we could meet with aluminium boards (in different thickness) pressed on basic material with a very variation possibilities. The most easiest type of that is a single sided basic material what has the possibility for the very easy power elements assembly what can be directly connected and screw to the heat sink. That assures the realization of the needed electricity static requirements. Naturally, to apply the epoxi-aluminium combination is necessary to introduce some new technologies in the chemical process and mechanical work. Hitelap created the needed production technology for this material-group and offer it to its customers.

With the above mentioned we would like to give you a little hint from that work what we focus on the technical development, we want to satisfy the customer's technical request. For us that's mean that we have to fulfill the requirements of the development. Not possible to take a break or stop! Moreover as you have seen the electronic - mainly the semiconductor- component development have requirements not only electrical but mechanical. Today the printed circuit board not only the achiever of the electrical connections but it is a multifunctional element of equipment.

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