Printed Circuit Boards

Hitelap Co. was established in 1989 primarily for the prototype and small- and medium-series production of printed circuit boards.

Hitelap Co has developed its capacity and internal organization for the manufacture of single-, double-sided and multilayer (up to 22 layers) printed circuit board with a short delivery time and professional quality.

What Hitelap can offer to you:

• Professional quality up to 22 layers
• Fast production term even 24 hours
• High standards
• Solidity
• Flexibility

Regarding to the requirement of the market Hitelap aimed to follow the technical possibilities and for today we have some special technologies:

• Connection gold surfacing
• Chemical gold surfacing (for bonding for either a 25um aluminium wire)
• Galvanic gold surfacing
• Carbon pasta printing
• Peelable mask printing
• Flying probe testing system (100% electric testing)
• Via plugg-in for BGA cases by silver pasta
• Modern thru-hole plating by horizontal automatic system, polymer system, drill with 0,1mm diameter thru-plated
• 100um-150um track width and track distance

Since the establishment we develop our manufacturing machines every year to be capable to serve of Central Europe's requirement. The business policy of the company is to meet its customer's demands in a maximal way.

In accordance with he requirements of professional electronics parameters regards to the IPC A 600G requirements and the company obtained UL qualification and the ISO 9001:2008 and the 14001:2004 qualifications.